The United States, Japan, Korea and Taiwan Held the First FAB 4 Preparatory Meeting

According to a foreign media on September 29th, the preparatory meeting of the U.S.-led chip alliance (Fab 4) including South Korea, the United States, Japan, and Taiwan was held for the first time on the morning of the 28th. The official title of the day’s meeting held by video conference was the “U.S. East Asian Semiconductor Supply Chain Resilience Working Group.”

 The South Korean Ministry of Foreign Affairs stated that the conference on that day was hosted by the American Institute in Taiwan (AIT), and the conference was attended by the U.S., South Korea, Japan and Taiwan. The South Korean side was attended by the representative of the Republic of Korea in Taipei as the chief representative, and the United States and Japan were also attended by the person stationed in Taiwan as the chief representative. It is reported that the Ministry of Foreign Affairs and the Ministry of Industry and Commerce of South Korea held talks in the form of visits by minister-level officials.

 At the meeting that day, the preparations for the future working group and the schedule of the next meeting were discussed. It is reported that the agenda of the next session will be decided based on the actual discussions of the working group, etc.